TAPE FILM PACKAGE AND MANUFACTURING METHOD OF THE SAME
摘要
PURPOSE: Tape film package and manufacturing method thereof are provided to increase the production yield by preventing or minimizing generation of metal particles. CONSTITUTION: A via contact (40) penetrates an insulation film (10). First wire patterns (30) are extended from the via contact to a cross section of the insulation film. Second wire patterns (50) are connected to the via contact below the insulation film, are parallel with the first wire patterns and are spaced apart from the cross section of the insulation film. A second solder resist (52) covers a part of the second wire patterns. The second solder resist is arranged below the insulation film between the second wire patterns and cross section.
申请公布号
KR20130086464(A)
申请公布日期
2013.08.02
申请号
KR20120007303
申请日期
2012.01.25
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
HA, JEONG KYU;KWON, YOUNG SHIN;LEE, KWAN JAI;JUNG, JAE MIN;CHO, KYONG SOON;HAN, SANG UK