| 摘要 |
PURPOSE: A downward type substrate etching device is provided to simplify the structure of an etchant spraying structure in a box shape and to reduce the thickness of a substrate by downwardly spraying an etchant to a plurality of vertically stacked substrates. CONSTITUTION: A downward type substrate etching device comprises a cassette and a spraying unit. At least one substrate is vertically stacked in the cassette. The spraying unit has a box shape consisted of a top plate (11), a lateral plate (13), and a bottom plate (15). A plurality of etchant spraying holes (15a) is formed on the bottom plate. The spraying unit sprays an etchant to at least one substrate through the etchant spraying holes. When an etchant spraying hole area and a substrate area are vertically overlapped, the etchant spraying hole area covers the substrate area. The etchant spraying hole area is a minimum plane area comprising all etchant spraying holes. The substrate is a minimum plane area comprising at least one substrate. |
