摘要 |
PURPOSE: An offset type wire to board connector is provided to be applied in a product requiring an ultra compact or ultra thin panel very usefully, by assuring an assembly space when a housing is connected to a header. CONSTITUTION: A header (110) is inserted and supported into a through-hole (21) of a substrate (20), and is soldered on the substrate by a fitting nail (150). A contact terminal (120) is inserted and installed in the header, and is electrically connected to a circuit pattern (22) on the substrate. A housing (130) is inserted and combined into a housing insertion groove (111), and includes a tension arm (138). A crimp terminal (140) is connected to a wire (W), and is electrically connected to the contact terminal. |