System for packaging kit for preparation of e.g. pizzas, has receptacle delimiting two volumes of packaging suitable for receiving pie base and topping ingredient, respectively, where pie base is previously shaped to reduce apparent surface

摘要

The system has a cover intended to cooperate with a receptacle (3) delimiting two volumes of packaging suitable for receiving a pie base (1) and a topping ingredient (2), respectively. The pie base is previously shaped to reduce an apparent surface, and the topping ingredient is placed in the packaging volume delimited by a peripheral edge (7) at a closed contour in which the receptacle and the cover are welded with each other. The pie base is formed by winding the pie base around a mandrel.