发明名称 DISPOSITIVO ELETTRONICO INTEGRATO A CONDUZIONE VERTICALE E RELATIVO METODO DI FABBRICAZIONE.
摘要 <p>An embodiment of a vertical-conduction integrated electronic device formed in a body of semiconductor material which includes: a substrate made of a first semiconductor material and with a first type of conductivity, the first semiconductor material having a first bandgap; an epitaxial region made of the first semiconductor material and with the first type of conductivity, which overlies the substrate and defines a first surface; and a first epitaxial layer made of a second semiconductor material, which overlies the first surface and is in direct contact with the epitaxial region, the second semiconductor material having a second bandgap narrower than the first bandgap. The body moreover includes a deep region of a second type of conductivity, extending underneath the first surface and within the epitaxial region.</p>
申请公布号 IT1401755(B1) 申请公布日期 2013.08.02
申请号 IT2010TO00723 申请日期 2010.08.30
申请人 STMICROELECTRONICS S.R.L. 发明人 SAGGIO MARIO GIUSEPPE;FRISINA FERRUCCIO;MAGRI' ANGELO
分类号 H01L29/78 主分类号 H01L29/78
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