| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for preventing the occurrence of blocking and adhesion in an inlet or a base material sheet in a temporary storage state in a manufacturing process and for suppressing decrease in adhesive strength of an adhesive in a finished form.SOLUTION: A base material sheet 22 is joined, through pressing in a thickness direction, with a sheet-like inlet 12 in which an IC chip 16 is mounted on a mounting surface of a film substrate 14. A base material sheet adhesion layer 18 is composed of a two-part adhesive and laminated on a joint surface adhered with the inlet 12 when the base material sheet 22 is seen in the thickness direction. A coating adhesion layer 20 is composed of a one-part adhesive and forms a coating of the two-part adhesive while being laminated in the thickness direction of the base material sheet adhesion layer 18. When the total thickness dimension (T1+T2) of the base material sheet adhesion layer 18 and the coating adhesion layer 20 is 12 μm, the thickness dimension (T1) of the coating adhesion layer 20 is larger than 0 μm and smaller than 7 μm. |
