SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing a semiconductor device which implement a large capacity and high reliability.SOLUTION: A segmented element part has at least two contiguous semiconductor chips cut apart from a semiconductor wafer having a plurality of semiconductor chips. Main electrodes 3 of all the individual chip areas in the segmented element part are hierarchically conductively interconnected by second to fourth main electrode wiring layers 3-2 to 3-4 laminated in order from an obverse side of the segmented element part. Only the fourth main electrode wiring layer 3-4 constituting the fourth layer of a wiring structure is exposed to an outermost surface of the segmented element part. First control electrode wiring layers 4-1 of all the individual chip areas in the segmented element part are hierarchically conductively interconnected by second to fourth control electrode wiring layers 4-2 to 4-4 laminated in order from the obverse side of the segmented element part. Only the fourth control electrode wiring layer 4-4 constituting the fourth layer of the wiring structure is exposed to the outermost surface of the segmented element part 2.