| 摘要 |
PROBLEM TO BE SOLVED: To improve a performance of a semiconductor device.SOLUTION: In a semiconductor device in which an IC part and a coil antenna connected to the IC part are formed on the same substrate, the coil antenna is formed by conductive layers ANT1, ANT2 which are layers different from each other. Between the conductive layers ANT1, ANT2, an interlayer insulation film is sandwiched. The conductive layers ANT1, ANT2 have overlapping parts OVL at each of which the conductive layers ANT1, ANT2 overlap each other via the interlayer insulation film in a direction perpendicular to a principal surface of a substrate. Each of the conductive layer ANT1 and the conductive layer ANT2 has a width narrower at the overlapping part OVL than at another part. |
