发明名称 WAFER CONVEYING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer conveying device capable of restraining failures that might occur when plural wafers are moved from a first location tool to a second location tool.SOLUTION: The wafer conveying device comprises: a first location tool 111a for locating plural wafers 881 while the wafers are laminated on each other; a first movement restraining tool 111b for restraining each of the plural wafers 881 located at the first location tool 111a from moving nearer a direction X1 than a first location position when seen in a lamination direction of the plural wafers 881 located at the first location tool 111a; a second location tool 112a for locating the plural wafers 881 while the wafers are laminated on each other; a first liquid injection mechanism 131 for applying a direction toward the direction X1 to the plural wafers 881 located at the first location tool 111a by injecting the liquid toward the plural wafers 881 located at the first location tool 111a; and a first wafer rising mechanism 121 collectively rising the plural wafers 881 located at the first location tool 111a and moving them to the second location tool 112a.
申请公布号 JP2013149705(A) 申请公布日期 2013.08.01
申请号 JP20120007750 申请日期 2012.01.18
申请人 NIPPON STEEL & SUMIKIN FINE TECHNOLOGY CO LTD 发明人 TSUKANAKA TEIHIKO;SEKIME HIRONARI
分类号 H01L21/677;B65G49/07;H01L21/304 主分类号 H01L21/677
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