LIGHT - EMITTING DEVICES HAVING DISCRETE PHOSPHOR CHIPS AND FABRICATION METHODS

摘要

In accordance with certain embodiments, phosphor chips are formed and subsequently attached to light-emitting elements. In one embodiment a substrate (720) is disclosed having a plurality of conductive traces (730) on a surface thereof, each pair of conductive traces being separated on the substrate by a gap therebetween; a plurality of light-emitting diode (LED) dies (710) each spanning a gap between conductive traces and having first and second spaced-apart contacts each electrically coupled to one of the conductive traces defining the gap; and a plurality of discrete phosphor chips (312), each phosphor chip (i) disposed over an LED die and positioned to receive light therefrom, and (ii) attached to the LED die by an attachment agent discrete from the LED die and the phosphor chip, wherein each phosphor chip comprises (i) a light-conversion material and (ii) a binder comprising at least one of silicone or epoxy, whereby the attachment agent might be formed by a clip, a frame attached to the substrate or a transfer tape.