| 摘要 |
A package (10) includes: a housing (1) wherein an electronic component (5) is mounted in a recessed portion (1a) having an opening on an upper surface; and a screw section (31) which extends laterally while being fixed on the side surface of the housing (1). The screw section (31) has: a thin wall part (34) which is provided on the tip end side and has a through-hole (36) for inserting a screw; a thick wall part (35) which is provided between the thin wall part (34) and the side surface of the housing (1), and is thinner than the thickness of the side of the housing (1) and thicker than the thin wall part (34); and a hole (37) for a fastening screw, which is provided vertically in the thick wall part (35). Even if the housing (1) is warped when the package (10) is fixed onto an eternal substrate, heat dissipation from the package to the external substrate can be improved. |
