发明名称 |
MOLTEN SOLDER INJECTION HEAD |
摘要 |
PROBLEM TO BE SOLVED: To provide a molten solder injection head in which a mask is prevented from being damaged and adhesion between the molten solder injection head and the mask can be improved.SOLUTION: A molten solder injection head comprises a main body 110 in which a bulk solder 10 is thrown into its upper part and an injection port 115 is formed in its lower part, a first heater 120 which is positioned in the main body 110 for melting the bulk solder 10, and a second heater 125 which is positioned around the injection port 115 and operates at a lower temperature than the first heater 120. |
申请公布号 |
JP2013149976(A) |
申请公布日期 |
2013.08.01 |
申请号 |
JP20130005177 |
申请日期 |
2013.01.16 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
MUKAI NORIAKI;OH HOON ZE;CHOI JIN-WON;LEE KUN-HEE |
分类号 |
H01L21/60;B23K3/06;B23K101/42;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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