发明名称 MOLTEN SOLDER INJECTION HEAD
摘要 PROBLEM TO BE SOLVED: To provide a molten solder injection head in which a mask is prevented from being damaged and adhesion between the molten solder injection head and the mask can be improved.SOLUTION: A molten solder injection head comprises a main body 110 in which a bulk solder 10 is thrown into its upper part and an injection port 115 is formed in its lower part, a first heater 120 which is positioned in the main body 110 for melting the bulk solder 10, and a second heater 125 which is positioned around the injection port 115 and operates at a lower temperature than the first heater 120.
申请公布号 JP2013149976(A) 申请公布日期 2013.08.01
申请号 JP20130005177 申请日期 2013.01.16
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 MUKAI NORIAKI;OH HOON ZE;CHOI JIN-WON;LEE KUN-HEE
分类号 H01L21/60;B23K3/06;B23K101/42;H05K3/34 主分类号 H01L21/60
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