发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a circuit including an inverter for a wiring layer.SOLUTION: A semiconductor device comprises a wiring layer circuit which is formed on an insulation film and which includes at least one inverter element. The inverter includes: a first transistor element; and a resistive element connected to the first transistor element via a connection node. The first transistor element includes: a gate electrode buried in an interlayer insulation film including the insulation film; a gate insulation film formed on the interlayer insulation film and the gate electrode; and a first semiconductor layer formed on the gate insulation film and between a source electrode and a drain electrode. The resistive element includes a second semiconductor layer functioning as resistance. The first semiconductor layer and the second semiconductor layer are formed in the same layer. |
申请公布号 |
JP2013149648(A) |
申请公布日期 |
2013.08.01 |
申请号 |
JP20120006874 |
申请日期 |
2012.01.17 |
申请人 |
RENESAS ELECTRONICS CORP |
发明人 |
KANEKO TAKAAKI;SUNAMURA JUN;HAYASHI YOSHIHIRO |
分类号 |
H01L29/786;H01L21/822;H01L21/8234;H01L27/04;H01L27/06;H01L27/08 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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