发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a circuit including an inverter for a wiring layer.SOLUTION: A semiconductor device comprises a wiring layer circuit which is formed on an insulation film and which includes at least one inverter element. The inverter includes: a first transistor element; and a resistive element connected to the first transistor element via a connection node. The first transistor element includes: a gate electrode buried in an interlayer insulation film including the insulation film; a gate insulation film formed on the interlayer insulation film and the gate electrode; and a first semiconductor layer formed on the gate insulation film and between a source electrode and a drain electrode. The resistive element includes a second semiconductor layer functioning as resistance. The first semiconductor layer and the second semiconductor layer are formed in the same layer.
申请公布号 JP2013149648(A) 申请公布日期 2013.08.01
申请号 JP20120006874 申请日期 2012.01.17
申请人 RENESAS ELECTRONICS CORP 发明人 KANEKO TAKAAKI;SUNAMURA JUN;HAYASHI YOSHIHIRO
分类号 H01L29/786;H01L21/822;H01L21/8234;H01L27/04;H01L27/06;H01L27/08 主分类号 H01L29/786
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