| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board where warpage is prevented from occurring due to temperature changes.SOLUTION: A wiring board includes a ceramic substrate 1 and a metal plate 12 which is joined to the ceramic substrate 1 and has multiple first metal layers 121 and a second metal layer 122 provided between the multiple first metal plates 121 and having a thermal expansion coefficient smaller than those of the multiple first metal layers 121. A thickness of an upper metal layer 121a, from among the multiple first metal layers 121, is smaller than a thickness of the lower metal layer 121b. The structure suppresses the deformation of the metal plate 12 thereby reducing warpage of the ceramic substrate 1 and warpage of the wiring board. |
