METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component capable of suppressing embedding of a detection unit in a resin without using a mold sealing the detection unit.SOLUTION: A method for manufacturing an electronic component comprises the steps of: preparing a sensor chip 20 in which a detection unit 31 which outputs a sensor signal corresponding to a physical amount is formed; preparing circuit chips 30 and 31 electrically connected to the sensor chip 20; preparing a substrate 10 in which a plurality of recesses 11 to 13 are formed on one surface; disposing the sensor chip 20 or the circuit chips 30 and 31 in each of the plurality of recesses 11 to 13; configuring a laminate 70 by disposing an adhesive film 50 which is composed of a thermoplastic resin and in which a through hole 52 is formed in a region facing the detection unit 21 on the substrate 10; and applying pressure to the laminate 70 from a lamination direction while heating the laminate 70 and bonding the substrate 10 to the adhesive film 50 with the detection unit 21 being exposed from the through hole 52.