发明名称 WAFER TRANSFER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer transfer device capable of preventing a wafer from being crushed when housed in a cassette.SOLUTION: A support mechanism supporting a plurality of wafers 881 includes a liquid jet mechanism for wafer flotation that forms a gap between the plurality of wafers by jetting liquid toward the plurality of wafers 881 supported by the support mechanism; a wafer receiving mechanism receiving the wafer positioned at the top among the plurality of wafers 881; a relay conveyor 32 transferring the wafer from the wafer receiving mechanism, and a speed reduction conveyor 33 reducing the speed of the wafer 881 sent by the relay conveyor 32.
申请公布号 JP2013149703(A) 申请公布日期 2013.08.01
申请号 JP20120007748 申请日期 2012.01.18
申请人 NIPPON STEEL & SUMIKIN FINE TECHNOLOGY CO LTD 发明人 TSUKANAKA TEIHIKO;SEKIME HIRONARI
分类号 H01L21/677;B65G47/57;B65G49/07 主分类号 H01L21/677
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