发明名称 |
WAFER TRANSFER DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer device capable of preventing a wafer from being crushed when housed in a cassette.SOLUTION: A support mechanism supporting a plurality of wafers 881 includes a liquid jet mechanism for wafer flotation that forms a gap between the plurality of wafers by jetting liquid toward the plurality of wafers 881 supported by the support mechanism; a wafer receiving mechanism receiving the wafer positioned at the top among the plurality of wafers 881; a relay conveyor 32 transferring the wafer from the wafer receiving mechanism, and a speed reduction conveyor 33 reducing the speed of the wafer 881 sent by the relay conveyor 32. |
申请公布号 |
JP2013149703(A) |
申请公布日期 |
2013.08.01 |
申请号 |
JP20120007748 |
申请日期 |
2012.01.18 |
申请人 |
NIPPON STEEL & SUMIKIN FINE TECHNOLOGY CO LTD |
发明人 |
TSUKANAKA TEIHIKO;SEKIME HIRONARI |
分类号 |
H01L21/677;B65G47/57;B65G49/07 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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