| 摘要 |
PROBLEM TO BE SOLVED: To provide means for inhibiting warpage in a state of being mounted on a substrate in a semiconductor package having central electrodes and peripheral electrodes.SOLUTION: A semiconductor package 10 comprises: a re-wiring board 14 including an overlap region 28 overlapping a semiconductor chip, and a peripheral region 30 which is a region except the overlap region; electrodes 16 for external connection arranged on a rear face 14b of the re-wiring substrate opposite to a semiconductor chip mounting surface; and a series of a plurality of electrodes arranged at a predetermined pitch, which include central electrodes 38 at least including electrodes arranged in the overlap region and peripheral electrodes 40 only including electrodes arranged in the peripheral region. The re-wiring substrate includes a stress relaxation part 44 for relaxing stress based on a linear expansion coefficient difference among the semiconductor chip, the re-wiring substrate and an encapsulation resin in a non-arrangement region 42 between an arrangement region of the central electrodes and an arrangement region of the peripheral electrodes, in which no electrode is arranged. |
