| 发明名称 |
THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD |
| 摘要 |
A circuit board with an embedded thermoelectric device with hard thermal bonds. A method of embedding a thermoelectric device in a circuit board and forming hard thermal bonds.
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| 申请公布号 |
US2013192655(A1) |
申请公布日期 |
2013.08.01 |
| 申请号 |
US201313798805 |
申请日期 |
2013.03.13 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
EDWARDS HENRY L.;MAGGIO KENNETH J.;KUMMERL STEVEN;KODURI SREENIVASAN K. |
| 分类号 |
H01L35/28;H01L29/02 |
主分类号 |
H01L35/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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