COOLING STRUCTURE AND ELECTRONIC DEVICE USING SAME

摘要

[Problem] When a cooling structure that is based on an ebullient cooling system is mounted in a thin electronic device, adequate cooling performance cannot be obtained. [Solution] This cooling structure has: an evaporation unit that is thermally connected to a heat-generating body and stores a refrigerant; a condensation unit that condenses the gas-phase refrigerant that has been vaporized by the evaporation unit; and piping that connects the evaporation unit and the condensation unit. The condensation unit includes a horizontally extended flat container, and there are connection ports on the side of the condensation unit for connecting to the piping. In addition, the condensation unit is equipped with a partition plate that divides the interior of the condensation unit into an upper space, located higher in the vertical direction, and a lower space, located lower in the vertical direction. The partition plate has an aperture part that connects the upper space and the lower space.