发明名称 SOLID-STATE IMAGE PICKUP APPARATUS, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS, AND ELECTRONIC APPARATUS
摘要 <p>This solid-state image pickup apparatus is provided with: a p-type compound semiconductor layer having a chalcopyrite structure; an electrode formed on the p-type compound semiconductor layer; and an n-type layer, which is separately formed by each pixel, said n-type layer being formed on the p-type compound semiconductor layer surface on the side opposite to the light incoming side of the p-type compound semiconductor layer.</p>
申请公布号 WO2013111637(A1) 申请公布日期 2013.08.01
申请号 WO2013JP50553 申请日期 2013.01.15
申请人 SONY CORPORATION 发明人 TAKAHASHI HIROTSUGU
分类号 H01L27/146;H01L31/10 主分类号 H01L27/146
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