发明名称 |
SOLID-STATE IMAGING ELEMENT, METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT, AND ELECTRONIC DEVICE |
摘要 |
Disclosed herein is a solid-state imaging element including: a semiconductor layer; a plurality of photoelectric conversion sections arranged within the semiconductor layer; and a pixel separating section disposed in a shape of a same width from a light receiving surface of the semiconductor layer to an opposite surface of the semiconductor layer from the light receiving surface in a position of separating the photoelectric conversion sections from each other for each pixel, the pixel separating section being formed by a material including an impurity.
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申请公布号 |
US2013193547(A1) |
申请公布日期 |
2013.08.01 |
申请号 |
US201313750693 |
申请日期 |
2013.01.25 |
申请人 |
SONY CORPORATION;SONY CORPORATION |
发明人 |
NAKAZAWA MASASHI |
分类号 |
H01L27/146;H01L31/18 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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