| 发明名称 |
SYSTEM AND METHOD FOR AN ELECTRONIC PACKAGE WITH A FAIL-OPEN MECHANISM |
| 摘要 |
In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.
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| 申请公布号 |
US2013194752(A1) |
申请公布日期 |
2013.08.01 |
| 申请号 |
US201213361742 |
申请日期 |
2012.01.30 |
| 申请人 |
MARBELLA CARLO BATERNA;PERIASAMY GANESH VETRIVEL;KOO KOK KIAT;TAN AI MIN;INFINEON TECHNOLOGIES AG |
发明人 |
MARBELLA CARLO BATERNA;PERIASAMY GANESH VETRIVEL;KOO KOK KIAT;TAN AI MIN |
| 分类号 |
H05K7/20;H01L21/52;H01L23/373 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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