| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-like wiring board having a high density wiring pattern having high adhesion strength even under high temperature atmosphere.SOLUTION: A wiring pattern 3 is formed on one surface of an insulating film 1 composed of polyimide and such, and a thin film formed by a sticking method of a metallic tape, a sputtering method, or an evaporation method is provided on the other surface of the insulating film 1 as an oxygen permeation prevention film 5 which prevents oxygen permeation. |
