发明名称 SUBSTRATE WITH BUILT-IN COIL AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce electrical resistance of wiring while considering characteristics of a coil conductor in a substrate with a built-in coil.SOLUTION: A substrate 1 with a built-in coil includes: a magnetic layer 11a; an insulator layer 11b provided on the magnetic layer 11a; a coil conductor 12 provided in the magnetic layer 11a; an element connecting electrode 13a provided on the insulator layer 11b; a first via conductor 14, a first wiring conductor layer 15, and a second via conductor 16 which are provided in the insulator layer 11b; a second wiring conductor layer 17 provided on the insulator layer 11b; and a side conductor 18 provided on a side surface of the insulator layer 11b. The second via conductor 16 is provided close to the first via conductor 14 in the insulator layer 11b.
申请公布号 JP2013149933(A) 申请公布日期 2013.08.01
申请号 JP20120169338 申请日期 2012.07.31
申请人 KYOCERA CORP 发明人 NOMURA MARI
分类号 H01F27/28;H01F17/00 主分类号 H01F27/28
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