ANISOTROPIC CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an anisotropic conductive material and a connection structure capable of making migration resistance in a copper electrode excellent when connected to a connection object member having the copper electrode on a surface thereof.SOLUTION: An anisotropic conductive material is used for connection of a connection object member having a copper electrode on a surface thereof. The anisotropic conductive material includes: a conductive particle 3 having metal whose melting point is 400°C or more on a conductive surface thereof; a curable composition capable of being cured by heating; a thermal curing agent; and a flux. A connection structure 21 includes: a first connection object member 22 having a first electrode 22b on a surface 22a; a second connection object member 23 having a second electrode 23b on a surface 23a; and a connection 1A. At least one of the first electrode 22b and the second electrode 23b is the copper electrode. The connection 1A is formed by curing the anisotropic conductive material.