发明名称 |
DEVICE FOR SPOT SIZE MEASUREMENT AT WAFER LEVEL USING A KNIFE EDGE AND A METHOD FOR MANUFACTURING SUCH A DEVICE |
摘要 |
The invention relates to a device for spot size measurement at wafer level in a multi charged particle beam lithography system. The device comprises a knife edge structure on top of a scintillating material, such a YAG material. The knife edge structure is arranged in a Si wafer which has a top plane at a sharp angle to a (1 1 0) plane of the Si. In an embodiment the angle is in the range from 2 to 4 degrees, preferably in the range from 2.9 - 3.1 degrees. The invention relates in addition to a method for manufacturing a device for spot size measurement at wafer level in a multi charged particle beam lithography system. |
申请公布号 |
WO2013112041(A1) |
申请公布日期 |
2013.08.01 |
申请号 |
WO2012NL50854 |
申请日期 |
2012.12.05 |
申请人 |
MAPPER LITHOGRAPHY IP B.V. |
发明人 |
MEIJER, JAN ANDRIES;SCHEFFERS, PAUL IJMERT;SARR, ABDOU |
分类号 |
H01J37/09;H01J37/30;H01J37/317 |
主分类号 |
H01J37/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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