| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a flip-chip semiconductor device on which various kinds of information are provided in a visible manner, which has simplified processes.SOLUTION: A flip-chip semiconductor manufacturing method comprises: a process A of laminating on a semiconductor wafer 4, a film 2 for a flip-chip semiconductor rear face to be formed on a rear face of a semiconductor element which is flip-chip connected on an adherend; a process B of dicing the semiconductor wafer 4; and a process C of producing laser marking on the film 2 for the flip-chip semiconductor rear face. The film 2 for the flip-chip semiconductor rear face in the process C is uncured. |
