| 摘要 |
PROBLEM TO BE SOLVED: To improve reflection characteristics of a circuit board to improve a light-emission efficiency in a surface mounting type LED device that has an LED die mounted on the circuit board, a translucent member for coating the LED die, and a reflection member laminated on a coating member, and that emits light from a lateral face.SOLUTION: A mat silver plating layer 27 is laminated on a surface of inner connection electrodes 14a and 15a provided on a circuit board 13 to form an irregular reflection surface (metal reflection layers 34 and 35). In addition, a translucent member 12 may contain phosphors 41 and 42. |
