发明名称
摘要 <p>A method of making a semiconductor device and devices thereof are provided. The semiconductor device (100) includes a semiconductor substrate (102) having opposing first and second surfaces (102a, 102b). The device further includes a planar inductor element (104) disposed on said first surface. The planar inductive element (103) comprises a freestanding electrical conductor extending along a meandering path and defining a plurality of windings (104), where the electrical conductor has a width and a height, and where a height-to-width (HW) ratio is substantially greater than 1.</p>
申请公布号 JP2013531369(A) 申请公布日期 2013.08.01
申请号 JP20130511370 申请日期 2011.05.20
申请人 发明人
分类号 H01L21/822;H01F17/00;H01L27/04 主分类号 H01L21/822
代理机构 代理人
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