| 摘要 |
<p>Provided is a power conversion apparatus having excellent assemblability. A power conversion apparatus (2) is provided with a semiconductor multilayer unit (20), a frame (12) having the semiconductor multilayer unit (20) attached thereto, and a spring unit (6). The semiconductor multilayer unit (20) has a structure wherein semiconductor modules (22) and cooling elements (21) are alternately stacked. The spring unit (6) is inserted to fit between one end (20a) of the semiconductor multilayer unit (20), said one end being in the stacking direction, and supporting columns (13), which are provided on the frame (12), and the spring unit fixes the semiconductor multilayer unit (20), while applying pressure to the semiconductor multilayer unit. The spring unit (6) is provided with a first plate (5), a second plate (4), and a coil spring (3), which is sandwiched between the first and the second plates. The first plate (5) is provided with a hollow (5b) to have a space between the first plate and the end surface (20a) of the semiconductor multilayer unit. The spring unit (6) is provided with a penetrating path, which passes the bottom surface of the hollow (5b), and penetrates the whole spring unit.</p> |
