发明名称 |
PACKAGE FOR MOUNTING LIGHT EMITTING ELEMENT, LIGHT EMITTING ELEMENT PACKAGE, AND MANUFACTURING METHODS OF PACKAGE FOR MOUNTING LIGHT EMITTING ELEMENT AND LIGHT EMITTING ELEMENT PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To provide a package for mounting a light emitting element which is excellent in heat radiation performance and easily deals with a narrow pitch light emitting element, a light emitting element package where the multiple light emitting elements are mounted on the package for mounting the light emitting element, and manufacturing methods of the package for mounting the light emitting element and the light emitting element package.SOLUTION: A package for mounting a light emitting element includes: a light emitting element mounting part where multiple pieces of wiring are disposed at predetermined intervals; and an insulation layer where the light emitting element mounting part is provided. An upper surface of the light emitting element mounting part is exposed from the insulation layer, and a lower surface is embedded in the insulation layer. Cutout parts are respectively formed at the lower sides of facing side edge parts of the wiring located adjacent to each other. |
申请公布号 |
JP2013149947(A) |
申请公布日期 |
2013.08.01 |
申请号 |
JP20120238318 |
申请日期 |
2012.10.29 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
DENDA TATSUAKI;KOBAYASHI KAZUKI |
分类号 |
H01L33/62 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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