发明名称 |
WIRING CONNECTION STRUCTURE BETWEEN TWO SUBSTRATES |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring connection structure between two substrates which prevents a liquid from entering into a joint part between circuit wiring of a first electronic circuit board and a connection terminal of a second electronic circuit board formed by a flexible substrate.SOLUTION: A portion of a flexible substrate 70, which is located close to a tip at the control substrate 60 side, has: a tip (an overlapped part 70A) overlapped on a surface of a control substrate 60; and an inclination part 70B extending obliquely upward from a proximal end of the overlapped part 70A. Each circuit wiring 72 of the flexible substrate 70 has a wide connection terminal 72a in a tip at the overlapped part 70A side. Each connection terminal 72a is joined to a joined part 621a of wiring for terminal connection wiring 621 of the control substrate 60 by solder 91. A liquid entry prevention wall 80 is formed on the control substrate 60 so as to enclose the overlapped part 70A of the flexible substrate 70. |
申请公布号 |
JP2013149907(A) |
申请公布日期 |
2013.08.01 |
申请号 |
JP20120011115 |
申请日期 |
2012.01.23 |
申请人 |
JTEKT CORP |
发明人 |
WAKITA YASUYUKI;NAKAI MOTOO |
分类号 |
H05K1/14;B62D5/04;H02K11/00 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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