发明名称 WIRING CONNECTION STRUCTURE BETWEEN TWO SUBSTRATES
摘要 PROBLEM TO BE SOLVED: To provide a wiring connection structure between two substrates which prevents a liquid from entering into a joint part between circuit wiring of a first electronic circuit board and a connection terminal of a second electronic circuit board formed by a flexible substrate.SOLUTION: A portion of a flexible substrate 70, which is located close to a tip at the control substrate 60 side, has: a tip (an overlapped part 70A) overlapped on a surface of a control substrate 60; and an inclination part 70B extending obliquely upward from a proximal end of the overlapped part 70A. Each circuit wiring 72 of the flexible substrate 70 has a wide connection terminal 72a in a tip at the overlapped part 70A side. Each connection terminal 72a is joined to a joined part 621a of wiring for terminal connection wiring 621 of the control substrate 60 by solder 91. A liquid entry prevention wall 80 is formed on the control substrate 60 so as to enclose the overlapped part 70A of the flexible substrate 70.
申请公布号 JP2013149907(A) 申请公布日期 2013.08.01
申请号 JP20120011115 申请日期 2012.01.23
申请人 JTEKT CORP 发明人 WAKITA YASUYUKI;NAKAI MOTOO
分类号 H05K1/14;B62D5/04;H02K11/00 主分类号 H05K1/14
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