发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that gives resin patterns with a large height difference when resin patterns having different heights are simultaneously formed on one substrate.SOLUTION: The photosensitive resin composition includes the following components (A), (B), (C) and (D): (A) a resin having a structural unit derived from at least one compound selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride and a structural unit derived from a monomer having a 2-4C cyclic ether structure and an ethylenically unsaturated bond, in which the content of the structural unit derived from a monomer having a 2-4C cyclic ether structure and an ethylenically unsaturated bond is 30 to 99 mol% with respect to the whole structural units of the resin; (B) a polymerizable compound; (C) a polymerization initiator; and (D) a compound expressed by formula (1). In formula (1), Lrepresents a 1-6C alkane diyl group or -S-; Rand Reach represent a 1-6C alkyl group; and m and n each represent an integer of 0 to 3.
申请公布号 JP2013148804(A) 申请公布日期 2013.08.01
申请号 JP20120010750 申请日期 2012.01.23
申请人 SUMITOMO CHEMICAL CO LTD 发明人 INOUE KATSUJI
分类号 G03F7/004;C07C39/16;C07C321/30;G03F7/031;G03F7/033 主分类号 G03F7/004
代理机构 代理人
主权项
地址