发明名称 |
MATERIALS AND PROCESSES FOR RELEASING PRINTABLE COMPOUND SEMICONDUCTOR DEVICES |
摘要 |
A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed.
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申请公布号 |
US2013196474(A1) |
申请公布日期 |
2013.08.01 |
申请号 |
US201113814343 |
申请日期 |
2011.08.04 |
申请人 |
MEITL MATTHEW;BOWER CHRISTOPHER;MENARD ETIENNE;CARTER JAMES;GRAY ALLEN;BONAFEDE SALVATORE |
发明人 |
MEITL MATTHEW;BOWER CHRISTOPHER;MENARD ETIENNE;CARTER JAMES;GRAY ALLEN;BONAFEDE SALVATORE |
分类号 |
H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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