| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head that can reduce possibility of sticking of plating caused to a connecting terminal.SOLUTION: A thermal head X1 includes: a substrate; a plurality of heating parts 9 installed on the substrate; and individual electrodes 19 installed on the substrate, having one ends electrically connected to the heating parts 9 and connecting terminals electrically connected with driving ICs 11 on the other ends. A plating layer 2 is provided in a part of the area located in the individual electrode 19 located between the heating part 9 and the connection terminal, while a plating layer 10 is provided on the connection terminal. |
