| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass substrate having an electronic device component included therein which, when an electronic device component is formed and even after a glass substrate having the electronic device component formed thereon is separated, excels in the flatness of a glass substrate surface and can therefore restrain a decline in the production yield of the electronic device component.SOLUTION: An electronic device manufacturing method comprises: a lamination step of laminating a resin layer included support substrate 18 and a glass substrate 16 closely one on top of another to obtain a glass laminate 10; a polishing step of polishing a second principal plane of the glass substrate; a component formation step of forming an electronic device component 22 on the polished second principal plane; and a separation step of separating the glass substrate 16 having the electronic device component 22 laminated thereon and the resin layer included support substrate 18 from each other to obtain an electronic device 24 including the glass substrate 16 and the electronic device component 22. In the electronic device manufacturing method, surface waviness on an exposed surface of a resin layer 14 is 0.1 μm or less in wave filtration center line waviness (W). |
