LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a liquid epoxy resin composition containing: (A) a liquid epoxy resin comprising at least one liquid epoxy resin represented by the following general formula (1) or (2): (B) a phenolic curing agent, (C) an accelerator in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of component (A), and (D) an inorganic filler in an amount of 20 to 900 parts by weight based on 100 parts by weight of component (A).