摘要 |
Aspects of the invention relate to techniques for repairing layout design defects after layout data have been processed by resolution enhancement techniques. The repair process first determines a re-correction region that includes three portions: core, context and visible portions. An inverse lithography process is then performed on the core portion of the re-correction region while taking into account effects from the context portion of the re-correction region to generate a first modified re-correction region. A traditional OPC process is then performed on the core and context portions of the first modified re-correction region while taking into account effects from the visible portion of the first modified re-correction region to generate a second modified re-correction region.
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