发明名称 |
RESIN COMPOSITION AND SEMICONDUCTOR MOUNTING SUBSTRATE OBTAINED BY MOLDING SAME |
摘要 |
A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent. Also provided is a semiconductor mounting substrate which is obtained by molding the resin composition. |
申请公布号 |
WO2013111697(A1) |
申请公布日期 |
2013.08.01 |
申请号 |
WO2013JP51068 |
申请日期 |
2013.01.21 |
申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
OKA, HIDEKI;TOMIOKA, NOBUYUKI;HONDA, SHIRO |
分类号 |
C08L63/00;C08G59/56;C08K3/36;C08K5/49;C08K5/5415;H01L23/14;H05K1/03 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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