发明名称 SUBSTRATE HOLDER AND PLATING APPARATUS
摘要 There is provided a substrate holder which can absorb a change in the thickness between substrates and can hold a substrate while preventing deflection of the substrate and keeping the amount of compression of a substrate sealing member within a certain narrow range. The substrate holder includes a first holding member and a second holding member, both for detachably holding a substrate by holding a peripheral portion of the substrate therebetween; and a substrate sealing member, mounted to the second holding member, for sealing the peripheral portion of the substrate along a substrate sealing line. The first holding member has a thickness absorbing mechanism which biases the substrate toward the second holding member at positions along the substrate sealing line.
申请公布号 US2013192983(A1) 申请公布日期 2013.08.01
申请号 US201313752460 申请日期 2013.01.29
申请人 EBARA CORPORATION;EBARA CORPORATION 发明人 FUJIKATA JUMPEI
分类号 C25D17/06 主分类号 C25D17/06
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