发明名称 |
CIRCUIT CONNECTION MATERIAL, CONNECTION BODY, AND METHOD FOR MANUFACTURING CONNECTION BODY |
摘要 |
PROBLEM TO BE SOLVED: To sufficiently prevent electrode breakage on a flexible substrate when connecting a circuit member having a flexible substrate by a circuit connection material including a conductive particle.SOLUTION: A circuit connection material includes an insulating adhesive and a conductive particle 5 dispersed in the insulating adhesive, and electrically connects a first circuit member having a first substrate and a first connection terminal 3 provided on the first substrate to a second circuit member having a second substrate 10 and a second connection terminal 1 provided on the second substrate. The circuit connection material is also used to bond the first circuit member to the second circuit member. The first substrate and/or the second substrate is a flexible substrate including a thermoplastic resin. The conductive particle includes a plastic particle and a metal layer covering the plastic particle. A K value when the conductive particle is compressively displaced by 20% of a diameter thereof is 0.20 to 3.2 GPa. |
申请公布号 |
JP2013149966(A) |
申请公布日期 |
2013.08.01 |
申请号 |
JP20120277028 |
申请日期 |
2012.12.19 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
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分类号 |
H05K3/32;C09J9/02;C09J11/00;C09J201/00;H01B1/00;H01B1/22;H01B5/16;H01L21/60;H01R11/01;H05K1/14 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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