| 摘要 |
PROBLEM TO BE SOLVED: To facilitate an equal-length wiring by simplifying a connection wiring structure.SOLUTION: An inspection device of the present invention comprises at least: a probe card that has a plurality of probes contacting a plurality of electrodes of each of the chips is arranged correspondingly to chips to be inspected on a semiconductor wafer; and a test head that is electrically connected to each of the probes on the probe card and applies a test signal from a tester to them. A plurality of tester lands on a probe substrate, which are electrically connected respectively to the plurality of probes, and a plurality of electrical connection parts on a tester side for the test head corresponding to each tester land are arranged so as to configure a plurality of array areas that are obtained by dividing an area correspondingly to the chips to be inspected. The plurality of probes on the probe substrate are connected to the corresponding tester lands that are provided on the array areas respectively for the chips to be inspected. |
