| 摘要 |
<p>Provided is a power conversion device capable of reducing stress acting on a mounting board by preventing a heat conducting member from being compressed by circuit components mounted on the circuit board. The power conversion device comprises: a semiconductor power module (11) embedding semiconductor switching elements for power conversion in a case body and having a cooling member (13) formed on one surface of the case body and contacting a cooling body; a mounting board (23) on which circuit components including a heat-generating circuit component for driving the semiconductor switching elements are mounted; a heat-conducting support member (33) for supporting the mounting board while maintaining a predetermined distance between the mounting board and the semiconductor power module and dissipating heat generated by the mounting board to the cooling body without interposing the chassis; and a heat conducting member (37) inserted between the heat-conducting support member and the mounting board and forming a recess portion (37c) for housing the heat-generating circuit component (39).</p> |
