METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND CONNECTOR

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, capable of manufacturing a semiconductor device which has high reliability without forming any void in a soldering process.SOLUTION: There is provided a method of manufacturing a semiconductor device characterized in that in a connector mounting process, a connector having a structure such that the whole or a part of a connection part 43 sandwiched between a contact part for a semiconductor chip and a contact part for an inner lead disperses a flow of inert gas and makes the dispersed inert gas flow downstream when one surface of the connector is directed to an upstream direction of the flow of the inert gas is mounted as a connector on a connector mounting surface of the semiconductor chip and a connector mounting surface of the inner lead, and in a soldering process, soldering is carried out with the one surface of the connector arranged facing the upstream direction of the flow of the inert gas.