| 摘要 |
PROBLEM TO BE SOLVED: To provide a band cutter device configured in such a way that a binding band is supported by a reaction force receiving means and the binding band is cut by moving a movable blade in a gap formed between the binding band and a material toward the reaction force receiving means in a direction crossing the binding band in non contact with the material, so that the material is prevented from being scratched when cutting the binding band.SOLUTION: A band cutter device includes; a stationary blade which intersects a binding band wound around stacked board materials and abuts on the binding band; a movable blade which freely moves backward and forward in a direction crossing the binding band separated from the board materials, and which can cut the binding band in cooperation with the stationary blade in non contact with the board materials; and a reaction force receiving means that can support the binding band against binding band cutting thrust of the movable blade. The band cutter device further includes a binding band buckling prevention means for stabilizing cutting resistance. |
