发明名称 |
WAFER CUTTING METHOD AND DEVICE |
摘要 |
A device for cutting a wafer provided with grooves on its upper surface having its lower surface supported by a flexible film secured to a frame. This device includes a system for locating the grooves and for positioning the frame with respect to a cutting system, and setting means for positioning the wafer in front of the locating system so that the located area is at a determined distance from the locating system.
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申请公布号 |
US2013192435(A1) |
申请公布日期 |
2013.08.01 |
申请号 |
US201313754660 |
申请日期 |
2013.01.30 |
申请人 |
STMICROELECTRONICS (TOURS) SAS;STMICROELECTRONICS (TOURS) SAS |
发明人 |
JARRY VINCENT;PRUNET PHILIPPE;FEUILLETTE THIERRY |
分类号 |
H01L21/463;B28D5/04 |
主分类号 |
H01L21/463 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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