摘要 |
A glass-silicon wafer stacked platform. The platform includes a plurality of silicon pillars defining a ferrule receptacle, a silicon spacer connected to bases of the pillars and enclosing an aperture, a glass wafer bonded to the spacer, a microlens array formed in a first surface of the glass wafer and located in the aperture, conductive material carried by a second surface of the glass wafer, and contacts in electrical communication with the conductive material |
申请人 |
HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.;MATHAI, SAGI VARGHESE;TAN, MICHAEL RENNE TY;SORIN, WAYNE VICTOR;ROSENBERG, PAUL KESSLER;PANOTOPOULOS, GEORGIOS;PATRA, SUSANT K |
发明人 |
MATHAI, SAGI VARGHESE;TAN, MICHAEL RENNE TY;SORIN, WAYNE VICTOR;ROSENBERG, PAUL KESSLER;PANOTOPOULOS, GEORGIOS;PATRA, SUSANT K |