| 摘要 |
<p>This substrate treatment apparatus has a configuration in which a control unit (21) operates a transfer unit (9) to apply a treatment liquid to a substrate (W) from a cassette stage (3) in an application unit (15) and cause a contamination substance to adhere to the substrate (W) in a heat treatment unit (19). Since the treatment liquid containing the contamination substance is applied to the substrate (W) to cause the contamination substance to adhere thereto, the substrate (W) for evaluation, on which contamination in a wet process is reproduced, can be manufactured. Moreover, since the substrate (W) is subjected to heat treatment in the heat treatment unit (19) after the treatment liquid is applied thereto, the substrate (W) for evaluation, which has undergone baking treatment, can be manufactured.</p> |
