发明名称 |
WITHDRAWAL CONTROL METHOD AND PLASMA PROCESSING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To withdraw a workpiece from an electrostatic chuck.SOLUTION: There is provided a withdrawal control method of a workpiece which comprises the steps of: introducing an inactive gas into a processing chamber after plasma processing and performing discharge processing while keeping the processing chamber at a first pressure; monitoring at least any of pressure of a heat-transfer gas supplied to a rear surface of the workpiece placed on an electrostatic chuck and a leak flow rate of the heat-transfer gas from the rear surface of the workpiece; determining a residual charge amount on a surface of the electrostatic chuck and positive and negative polarities of the residual charge from the monitoring results, determining voltage for supplying charge having the same size as the residual charge amount and polarities opposite to the positive and negative polarities to a chuck electrode 40a, and turning on the voltage to the chuck electrode; exhausting the inactive gas in the processing chamber while turning on the voltage determined on the basis of the monitoring results to the chuck electrode and reducing the pressure in the processing chamber to a second pressure; and turning off the voltage being on to the electrostatic chuck and withdrawing the workpiece from the electrostatic chuck via a support pin. |
申请公布号 |
JP2013149935(A) |
申请公布日期 |
2013.08.01 |
申请号 |
JP20120182706 |
申请日期 |
2012.08.21 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
SENZAKI SHIGERU;MIKAMI SHUNICHI;TOBANA TOSHIKATSU |
分类号 |
H01L21/683;H01L21/3065;H02N13/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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