ELECTRONIC COMPONENT CONNECTION MATERIAL AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component connection material having a high flux effect and capable of enhancing conduction reliability when used for an electrical connection between electrodes.SOLUTION: The electronic component connection material contains: a binder resin; a conductive particle 1 at least an external surface of which is solder; and a flux having a carboxyl group whose melting point is 90°C or higher and 125°C or lower. A content of the conductive particle 1 in 100 weight% of the electronic component connection material is 3 weight% or higher and 40 weight% or lower.